GF-RK3399-Kit

High-performance industrial chips for embedded devices. Stable operation & full specifications. Factory direct supply with favorable prices. Bulk orders are welcome, feel free to contact us!

Relief Ceramic Bowls Parameters:

Manufacturer

Lianyuan

Product Type

Bowls

Pattern

Diamond Relief Texture & Floral Pattern

Color

Pink, Yellow, Green, Blue

Material

Durable Porcelain

Craftsmanship

Embossed, In-glazed Decal

Application

Microwave and Dishwasher Safe, Oven Safe

Custom

Color/Size/Logo/Package

Product Description

Parameter Specification Item Specification
CPU Rockchip RK3399 (28nm HKMG process) Architecture Cortex-A722 + Cortex-A534
Main Frequency 1.8GHz RAM 2GB LPDDR (64-bit data bus LPDDR4) (2GB/4GB optional)
Flash 8GB eMMC, eMMC5.1 (8GB/16GB/32GB optional) GPU ARM® Mali-T860 MP4 Quad-core GPU; Supports OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11, AFBC (Frame Buffer Compression)
VPU Supports 4K VP9 and 4K 10bits H.265/H.264 video decoding, up to 60fps 1080P multi-format video decoding (WMV, MPEG-1/2/4, VP8); 1080P video encoding, supports H.264, VP8 formats; Video post-processor: De-interlacing, denoising, edge/detail/color optimization PMU RK808 PMU Power Management Unit
Ethernet Port 1x 10/100/1000Mbps Ethernet (RGMII mode); 1x 10/100/1000Mbps Ethernet (PCIe expansion) Wi-Fi On-board WiFi+Bluetooth 2-in-1 module, supports 2.4GHz/5GHz dual-band WiFi, 802.11a/b/g/n/ac protocol, Bluetooth BT4.0 (supports BLE)
4G MINI-PCIE interface (USB2.0 communication), external 4G LTE module, on-board SIM card slot Display Interface HDMI2.0 display interface, 4K@60fps output, supports HDCP 1.4/2.2; Dual-channel MIPI-DSI display interface (4 lanes per channel), including 1 channel for extended dual-channel LVDS display interface; eDP1.3 (4 lanes, 108Gbps)
Camera Interface MIPI camera interface USB 1x USB3.0 HOST interface; 1x USB Type-C interface; 4x USB2.0 HOST interfaces
UART 1x RS232 DEBUG debug serial port; 5x RS232 serial ports (3-wire); 1x UART-TTL serial port (TTL level); 1x RS485 interface Audio Interface 2x Speaker, speaker output; 1x headphone output; 1x microphone audio input
Storage Interface 1x TF card Expansion Interface 1x I2C interface; 8x GPIO interface
Other Equipment Reset circuit, watchdog circuit, RTC clock Power Input +12V power supply
Core Board Size 82mm*63mm, 8-layer board high-precision gold immersion process Baseboard Size 158mm*121mm, 4-layer board high-precision gold immersion process
Power Consumption Power consumption ≤5W (whole board no-load power consumption) Operating Temperature 0°C ~ +60°C
Operating Humidity 5% to 95%, non-condensing Operating System Android

Trusted Chips Manufacturer


The integration and expansion of our R&D, manufacturing, and market capabilities lay a solid foundation for our vision of becoming a specialized, global provider of embedded hardware and software solutions.

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