IAC-335X-CM

High-performance industrial chips for embedded devices. Stable operation & full specifications. Factory direct supply with favorable prices. Bulk orders are welcome, feel free to contact us!

Relief Ceramic Bowls Parameters:

Manufacturer

Lianyuan

Product Type

Bowls

Pattern

Diamond Relief Texture & Floral Pattern

Color

Pink, Yellow, Green, Blue

Material

Durable Porcelain

Craftsmanship

Embossed, In-glazed Decal

Application

Microwave and Dishwasher Safe, Oven Safe

Custom

Color/Size/Logo/Package

Product Description

Parameter Specification Item Specification
CPU TI AM3354 Architecture ARM Cortex A8
Main Frequency 600MHz, 720MHz, 800MHz RAM 256MB DDR2 SDRAM
Flash 256MB NandFlash, 2MB DataFlash System Power Single 5V power input, outputs all voltages required by the core board
Ethernet Port 2x Industrial 10/100/1000Mbps Ethernet, with ACT/LINK indicators UART 5x RS232 serial ports, including: 1x debug serial port, 2x RS232 shared with RS485
USB 2x USB2.0, High-Speed OTG Display Interface 16-bit TFT-LCD (compatible with 18/24-bit), resolution up to 2048×2048; VGA interface for connecting to general monitors
Audio Interface McASP audio interface, stereo input/output, MIC audio input Input Interface 4-wire resistive touch screen
CAN 2x CAN bus interfaces, fully supports CAN2.0A and CAN2.0B protocols Expansion Interface GPMC for connecting peripheral devices such as FPGA and FLASH
Storage Interface 1x SD card interface Other Equipment Reset circuit, wake-up function, real-time clock, buzzer, JTAG interface
Power Input +12V power supply, supports wide voltage input of +4.7V~+18V Core Board Size 74mm×53mm, 6-layer board with high-precision gold immersion process
Baseboard Size 142mm×112mm, 4-layer board with high-precision gold immersion process Power Consumption Single-board power consumption < 2W
Operating Temperature -20°C ~ +70°C, -40°C~+85°C (optional) Operating Humidity 5% to 95%, non-condensing
Operating System Linux

Trusted Chips Manufacturer


The integration and expansion of our R&D, manufacturing, and market capabilities lay a solid foundation for our vision of becoming a specialized, global provider of embedded hardware and software solutions.

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